Brief: Discover the High Frequency Fast Turn Prototype PCB Board with a back drill potential of 0.15mm, ideal for complex networking and server applications. This multilayer PCB offers superior signal integrity, power delivery, and emissions control, with advanced features like a 0.05/0.05mm line width/space and multiple surface treatments.
Related Product Features:
Multilayer PCB with 2-48 layers, perfect for high-end networking and server applications.
Minimum line width/space of 0.05/0.05mm for superior signal integrity.
Minimum PAD of 0.14mm for inner layer, ensuring high-quality performance.
Aspect ratio of 20:1, supporting complex designs and high-frequency applications.
Multiple surface treatments available, including HASL, ENIG, Immersion Silver, and more.
Withstands up to four times laminations, enhancing durability and reliability.
Maximum board size of 1000*600mm, suitable for large-scale applications.
Impedance control of ±5%, ensuring precise performance in high-frequency environments.
FAQ's:
What is the minimum back drill potential for this PCB board?
The minimum back drill potential for this PCB board is 0.15mm, ensuring high precision and performance in complex applications.
What surface treatments are available for this multilayer PCB?
This multilayer PCB offers a variety of surface treatments, including HASL, ENIG, Immersion Silver, OSP, Immersion TIN, ENIG+OSP, HASL+ Goldfinger, Electroplated Gold, and Electroplated Silver.
What is the maximum board size and thickness supported by this PCB?
The maximum board size supported is 1000*600mm, with a maximum board thickness of 6.0mm, making it suitable for large-scale and high-performance applications.