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Multilayer HDI PCB fabricage ODM met blinde gat aspect ratio 1 1

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January 14, 2025
Category Connection: HDI-de Raad van PCB
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Taggen:
#HDI-circuitborden #hdi multilayer PCB #hdi printplaat assemblage
Brief: Discover the advanced BGA Pitch 0.3mm HDI PCB Board, a high-density interconnect solution perfect for consumer electronics. With customizable features like a min. core thickness of 0.05mm and blind hole aspect ratio of 1:1, this PCB prototype board ensures precision and reliability for your high-tech devices.
Related Product Features:
  • BGA Pitch of 0.3mm ensures high precision and accuracy in component placement.
  • Min. core thickness of 0.05mm enhances durability and reliability.
  • Max. board size of 540*620mm accommodates a wide range of consumer electronics.
  • Min. line width/space of 0.04mm allows for complex circuitry and smaller components.
  • Misalignment tolerance of +/- 0.06mm ensures precise layer alignment.
  • Vias aspect ratio of 16:1 supports high-density interconnect technology.
  • Min. mechanical drill hole size of 0.1mm for intricate designs.
  • Board thickness range of 0.2-3.2mm suits various application needs.
FAQ's:
  • What is the BGA pitch of the HDI PCB Board?
    The BGA pitch of the HDI PCB Board is 0.3mm, ensuring high precision in component placement.
  • What is the minimum core thickness of the HDI PCB Board?
    The minimum core thickness of the HDI PCB Board is 0.05mm, providing enhanced durability and reliability.
  • What industries can benefit from using the HDI PCB Board?
    The HDI PCB Board is ideal for consumer electronics, aerospace, medical equipment, telecommunications, and automotive industries due to its high-density interconnect technology and reliability.
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